佳工机电网 在线工博会 我的佳工网 手机版 English
关键字  
  选择展区 >>
您的位置: 首页 > CAD/CAM/PDM/PLM展区 > CAE/模拟仿真展厅 > 新闻 > 正文 产品 会展 人才 帮助 | 注册 登录  
CAE/模拟仿真
 按行业筛选
 按产品筛选
本产品全部新闻


e展厅 产品库 视频 新闻 技术文章 企业库 下载/样本 求购/论坛
  市场动态 | 技术动态 | 企业新闻 | 图片新闻 | 新闻评论 佳工网行业新闻--给您更宽的视角 发表企业新闻 投稿 
Siemens EDA
首页 | 公司介绍 | 产品与服务 | 新闻 | 技术文章 | 联系方式
Flomerics Releases FLO/PCB Version 4.1 9/23/2007 11:25:00 PM

Flomerics Releases FLO/PCB Version 4.1

(6 September 2007) -- Flomerics has released Version 4.1 of its FLO/PCB thermal design software with new features including the ability to model potting compounds, probe temperature values interactively, provide user-defined temperature ranges and search component libraries. FLO/PCB makes it possible to perform board-level thermal simulation very early in the design process. This analysis can help highlight potential thermal issues and provide engineers with more flexibility in resolving them before hundreds of hours of engineering time is invested in unusable designs.

Version 4.1 of FLO/PCB includes a new SmartPart object used to represent epoxy type solid cured potting compounds. It can be placed over all or part of either side of the PCB. Multiple (non-overlapping) potting compound regions can be defined. Any material in the resins material library supplied with the software can also be used or the user can define the properties using the potting compound material property sheet.

The new version also provides the ability to move the cursor over a temperature plot in the results visualization mode and report the point temperature. The legend scaling options have also been improved so that the user can define minimum and maximum values for the upper and lower bounds of the scale. The minimum and maximum values can also be derived from the coldest and hottest objects in the simulation results.

Version 4.1 also includes an advanced search capability for the component library. Users typically save components that they create into a library, from which they can be recalled and quickly placed into a new board design.
FLO/PCB Version 4.1 has also been updated to maintain bi-directional connectivity with Version 7.1 of Flotherm, Flomerics?system-level thermal modeling tool. For example, the same PCB design that is used to create a FLO/PCB model can also be incorporated into a system-level model in Flotherm. This saves time for the mechanical engineer in updating the system level model, if necessary, while reducing the chance of errors caused by miscommunication. The results from the systems level analysis can also be exported directly to the board-level simulation, making it possible for the board designer to apply the air flow and temperatures from the system-level simulation to the board being designed. This approach keeps all team members in sync and enables them to contribute to concept development in real time.

For more information, visit Flomerics' Web sites www.flopcb.com and www.flomerics.com

欢迎访问e展厅
展厅
2
CAE/模拟仿真展厅
通用有限元分析软件, 结构分析软件, 动力学分析软件, 声学分析软件, 板料冲压成形模拟软件, ...


发表评论】【新闻评论】【论坛】【收藏此页
更多有关CAE/模拟仿真的新闻:
·[图]西门子基于多学科仿真助力电动汽车轴向磁通电机开发 2/24/2024
·西门子推出 HEEDS AI Simulation Predictor 和 Simcenter Reduced Order Modeling 解决方案 11/29/2023
·[图]DOMO 新的注塑成型模拟数据库可确保客户加快开发时间 5/18/2022
·[图]新一轮科技浪潮:机器人与互联网的结合物PCbotNet 9/19/2007
·[图]互联网迎来三维时代 9/17/2007
·[图]西迪阿特将上市热设计辅助工具新版本 9/5/2007
·[图]ESI发布支持液态复合材料成型的模拟软件 8/31/2007
·[图]安世亚太推出国内首款企业级协同仿真平台PERA 2007 8/31/2007
·[图]3D电磁仿真技术帮助提升汽车用蓝牙天线的性能 7/22/2007
·森精机运用高精数字技术优化机床构造设计 7/19/2007
查看与本新闻相关目录:
·CAD/CAM/PDM/PLM展区 > CAE/模拟仿真展厅 > CAE/模拟仿真技术动态
·电子/通讯/办公文具展区 > 电子工业设备展厅 > 电子工业设备技术动态
·电子元器件及材料展区 > PCB/其它元器件展厅 > PCB/其它元器件技术动态
Siemens EDA联系方式:
网址: https://cn.mentor.com/ 电话:86-21-6101-6300
地址: 中国·上海·上海市浦东新区杨高南路759号陆家嘴世纪金融广场2号楼5楼 邮编200041

对 CAE/模拟仿真 有何见解?请到
CAE/模拟仿真论坛 畅所欲言吧!





网站简介 | 企业会员服务 | 广告服务 | 服务条款 | English | Showsbee | 会员登录  
© 1999-2024 newmaker.com. 佳工机电网·嘉工科技