佳工机电网 在线工博会 我的佳工网 手机版 English
关键字  
  选择展区 >>
您的位置: 首页 > CAD/CAM/PDM/PLM展区 > CAE/模拟仿真展厅 > 新闻 > 正文 产品 会展 人才 帮助 | 注册 登录  
CAE/模拟仿真
 按行业筛选
 按产品筛选
本产品全部新闻


e展厅 产品库 视频 新闻 技术文章 企业库 下载/样本 求购/论坛
  市场动态 | 技术动态 | 企业新闻 | 图片新闻 | 新闻评论 佳工网行业新闻--给您更宽的视角 发表企业新闻 投稿 
COMSOL,
COMSOL, Inc.
首页 | 公司介绍 | 产品与服务 | 新闻 | 技术文章 | 联系方式
COMSOL Multiphysics Version 4.0 Now Shipping 5/2/2010 7:10:00 PM

COMSOL Multiphysics Version 4.0 Now Shipping

COMSOL Multiphysics® version 4.0 delivers the COMSOL Desktop™, an all-new user interface that makes it easy for users to build and run simulations.

New breakthrough user interface makes the power of multiphysics simulation available to a wider audience.

BURLINGTON, MA (April 30, 2010)— COMSOL Inc. announces that version 4.0 of its multiphysics simulation software is now shipping. First unveiled at the 2009 users conference in Boston, COMSOL Multiphysics version 4.0 features an all-new user interface that makes the power of multiphysics simulation available to a wider audience of scientists and engineers. Both expert analysts and non-experts alike will benefit from the organized layout and streamlined model-building process. Along with the release of version 4.0, COMSOL also announces the release of a series of new LiveLink™ options that tightly integrate COMSOL Multiphysics into the mainstream product design workflow. New LiveLink products are now shipping for Autodesk® Inventor®, Pro/ENGINEER®, SolidWorks®, and MATLAB®.

''It feels great to make version 4.0 available,'' comments Svante Littmarck, President and CEO of COMSOL, Inc. ''We believe this release represents a bold step forward in usability that will increase productivity and problem solving capacity.'' Version 4.0 is also a platform for accelerating the pace of development of new functionality. ''Customers will notice this effect in the very near future: version 4.0a, available this June, includes three new modules for CFD, Plasma, and Batteries & Fuel Cells,'' says Littmarck.

COMSOL Desktop - New Breakthrough User Interface

Model set up is smooth and direct, making tough problems quick and easy to solve. Version 4.0 brings an unprecedented level of clarity to product design simulation by combining an organized model overview and a streamlined model-building process in the new COMSOL Desktop. It uses functional form, structure, and aesthetics as the means to achieve simplicity for modeling complex physical realities. For instance, task-specific tools appear on the Desktop right when you need them and show only the currently possible and necessary actions. This helpful user convenience removes uncertainty from model building and brings order to simulations.

ZINK Imaging, the inventor of the ZINK Technology and the manufacturer of ZINK Paper™ -- a revolutionary approach to full-color printing of information and images with unparalleled simplicity -- makes frequent use of COMSOL Multiphysics within product invention, development, and manufacturing. Dr. Bill Vetterling, Research Fellow and Director of the Image Science Lab at ZINK Imaging, attended the 2009 COMSOL Conference and tried out the new user interface. "The version 4.0 prerelease that was made available to attendees was a great way to try out new features,'' says Dr. Vetterling.

Simulation of a Rzeppa constant velocity joint using COMSOL Multiphysics Version 4. All model settings are controlled directly from the Model Builder and its context based Settings window. The Graphics window displays the displacements of the joint when the shaft reaches the maximum angle. Model courtesy of Metelli S.p.A. (Cologne, Italy)

''Version 4.0, by the way, is a masterpiece! It was a special treat this year to explore its fresh, new interface and insightful approach to the overall management of data,'' adds Dr. Vetterling. "In my experience, COMSOL Multiphysics is a product that makes significant advances year after year."

LiveLink family of products for integrating with CAD, MATLAB

By adopting COMSOL simulation, CAD software users can now accurately simulate how real-world physical effects shape the design of new products. To this end version 4.0 features the optional LiveLink family of products. Each LiveLink connects COMSOL Multiphysics directly with leading CAD programs so that all parameters specified in a CAD model can be interactively linked with simulation geometry. The current product line includes LiveLink™ for SolidWorks®, LiveLink for Inventor®, and LiveLink for Pro/ENGINEER®. In addition, LiveLink for MATLAB® is available for those who need to incorporate a COMSOL Multiphysics model into an extended technical computing and programming environment.

COMSOL Multiphysics on Windows HPC Server 2008

COMSOL Multiphysics version 4.0 now runs on Windows HPC Server 2008, creating a scalable and affordable high performance computing solution for simulation and virtual prototyping. Current users with a COMSOL Multiphysics version 4.0 floating network license will be able to deploy across as many Windows HPC Server 2008 nodes as they choose, at no additional COMSOL Multiphysics licensing cost.

''By creating applications that run on Windows HPC Server 2008, scientific and engineering software companies like COMSOL are helping speed discovery'', said Vince Mendillo, senior director, Microsoft High Performance Computing Group. '' Scientists, engineers and analysts need easy-to-use tools and accessible high performance computing power to create competitive advantage.''

COMSOL Multiphysics supports parallel processing through standard shared-memory multicore computers as well as distributed-memory clusters. Users can turn to clusters to solve a series of parameter steps for a model, one parameter per node, or they can solve a single large model using distributed memory. For maximum performance, the COMSOL cluster implementation can utilize shared-memory multicore processing on each node in combination with the MPI-based distributed memory model.

Multiphysics simulation for Windows HPC Server 2008. Solve a parameterized problem, with parameter steps distributed to different physical cluster nodes (left). Solve a single problem distributed to different physical nodes.(right)

COMSOL Multiphysics version 4.0 Highlights

COMSOL Desktop lets you organize your workflow and provides a clean overview of your simulation job

Quick model set-up in the Model Builder and its graphical programming utility throughout the modeling and simulation process

LiveLink family of products for using COMSOL with CAD:

LiveLink™ for Inventor®
LiveLink™ for Pro/ENGINEER®
LiveLink™ for SolidWorks®

LiveLink™ for MATLAB® to use multiphysics models in a programming environment

Extend your existing floating COMSOL Multiphysics license at no additional charge to additional nodes for clusters on Windows Compute Cluster Server 2003, Windows HPC Server 2008, and Linux

Geometry parameter sweeps with full associativity

New solvers

Modal solver for frequency response and time domain (for structural and acoustics simulations for example)
Direct solvers MUMPS and SPOOLES for cluster computing

Fully automated simulation configuration of solver settings, solver sequences, mesh settings, and result visualization

Fast graphics with new functionality:

Display of multiple plots simultaneously
Probes - measure and plot anything during the solution process
Data sets - create new solution data by operating on old data and use for postprocessing

New in Application Specific Modules

Structural and Acoustics:

Automated boundary conditions for structural-acoustics
Elastic materials defined using bulk modulus and shear modulus, Lamé constants, and pressure-wave and shear-wave speed in addition to Young's modulus and Poisson's ratio
Poroelasticity for anisotropic materials
Rigid connector boundary condition for rigid pins and kinematic constraints such as prescribed rigid rotations
Structural shell for large deformations

Heat Transfer:

Conjugate heat transfer (flow, fluid heat transfer, and solid heat transfer) for electronic cooling and heat sinks
Heat radiation in participating media
Heat transfer in porous media with multiple immobile solids

AC/DC, MEMS, and RF:

Electrical circuit elements (including resistors, capacitor, and inductors)
Fast-frequency sweep solver (Asymptotic Waveform Evaluation)
Transition boundary condition for thin metallic layers of arbitrary electrical thickness

Fluid Flow:

Improved turbulence models and low-Reynolds turbulence model
Mixture-averaged diffusion for concentrated species
Physics interface for fracture flow in structures with highly permeable thin shells and fractures
Availability

COMSOL Multiphysics version 4.0 is available for the Windows, Linux, and the Macintosh operating systems directly from COMSOL and from COMSOL's global network of distributors immediately. Full details about COMSOL Multiphysics and related products are available at www.comsol.com.

About COMSOL Multiphysics

COMSOL Multiphysics is a software environment for the modeling and simulation of any physics-based system. A particular strength is its ability to account for multiphysics phenomena. Optional modules add discipline-specific tools for acoustics, chemical engineering, earth science, electromagnetics, heat transfer, MEMS, and structural analysis.

This is COMSOL

COMSOL was founded in 1986 in Stockholm, Sweden, and has grown to include offices in the Benelux countries, Denmark, Finland, France, Germany, India, Italy, Norway, Switzerland, the United Kingdom, and in the US with offices in Burlington, MA, Los Angeles, CA, and Palo Alto, CA. Additional information about the company is available at www.comsol.com.

欢迎访问e展厅
展厅
2
CAE/模拟仿真展厅
通用有限元分析软件, 结构分析软件, 动力学分析软件, 声学分析软件, 板料冲压成形模拟软件, ...


发表评论】【新闻评论】【论坛】【收藏此页
更多有关CAE/模拟仿真的新闻:
·[图]西门子基于多学科仿真助力电动汽车轴向磁通电机开发 2/24/2024
·西门子推出 HEEDS AI Simulation Predictor 和 Simcenter Reduced Order Modeling 解决方案 11/29/2023
·[图]DOMO 新的注塑成型模拟数据库可确保客户加快开发时间 5/18/2022
·西门子STAR-CCM+软件满足ASME NQA-1合规要求 7/14/2017
·Altair突破整车碰撞仿真的时间极限 4/30/2010
·3M公司发布ANSYS仿真软件材料库 4/28/2010
·LMS推出LMS Imagine.Lab燃料电池解决方案 4/21/2010
·[图]esi集团宣布虚拟样机的集成平台Visual-Environment 5.5版本发布 4/20/2010
·金属切削仿真软件AdvantEdge FEM 5.5发布 4/16/2010
·[图]adidas运用达索系统SIMULIA精心打造由内而外更出色的运动鞋 4/16/2010
查看与本新闻相关目录:
·CAD/CAM/PDM/PLM展区 > CAE/模拟仿真展厅 > CAE/模拟仿真技术动态
COMSOL, Inc.联系方式:
网址: http://www.femlab.com 电话:-781-273-3322
地址: 其他国家/地区·省份·1 New England Executive Park Suite 350 Burlington

对 CAE/模拟仿真 有何见解?请到
CAE/模拟仿真论坛 畅所欲言吧!





网站简介 | 企业会员服务 | 广告服务 | 服务条款 | English | Showsbee | 会员登录  
© 1999-2024 newmaker.com. 佳工机电网·嘉工科技